Orbotech Revolutionizes the AOI Room with 4-in-1 AOI Solution

 

Orbotech's new Ultra Dimension™ Series reduces the total cost of ownership of the PCB AOI room by integrating leading pattern inspection, laser via inspection, Remote Multi-Image Verification (RMIV) and 2D metrology into a single AOI solution

YAVNE, Israel, Oct. 24, 2017 /PRNewswire/ -- Orbotech Ltd., (NASDAQ: ORBK) a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products, today introduced the groundbreaking Ultra Dimension Automated Optical Inspection (AOI) Series for PCB production. Designed to meet the rigorous demands of advanced PCB manufacturing processes, the innovative Ultra Dimension is the first AOI solution to integrate four leading solutions - pattern inspection, laser via inspection, Remote Multi-Image Verification and 2D metrology - into a single system. This solution enables manufacturers to increase quality and yield as well as dramatically reduce their overall total cost of ownership (TCO), signifying a revolution in the AOI room workflow.  

Orbotech will unveil the Ultra Dimension Series and the Company's concept of the new AOI room in Booth J1126 at TPCA, Taipei Nangang Exhibition Center, Taiwan from 25 -27 October 2017.

"Orbotech's Ultra Dimension sets new quality and functionality standards for the AOI room workflow," said Mr. Arik Gordon, Corporate Vice President and President of Orbotech's PCB Division. "The combination of four different systems in one solution creates a whole that is greater than the sum of its parts, each of which works in total synergy with the others. This represents a highly innovative step forward in the way that the AOI room operates, and will offer our customers significant improvements in quality and yield, as well as cost efficiencies, as they work to meet the growing demands of advanced electronics manufacturing."

Ultra Dimension's combination of high precision and high quality pattern inspection and laser via (LV) inspection in a single scan is powered by Orbotech's proprietary Triple Vision Technology™ and Magic Technology™. By using varied light settings and three different types of images, these technologies enable Ultra Dimension to improve detection capabilities significantly, reduce false alarms and decrease inspection set-up time. This, in turn, allows manufacturers of advanced PCBs using SLP/mSAP (substrate-like PCB/modified semi-additive process) the flexibility to inspect a variety of applications and materials, and eliminates the need to use inspection masks which can cause defects to be overlooked.

Orbotech's 2D metrology automatically measures both top and bottom conductor widths for lines and pads of a wide variety of shapes, enabling the higher accuracy and impedance control necessary for SLP/mSAP as well as advanced HDI applications.

Orbotech's Remote Multi-Image Verification (RMIV) enables the remote verification of multiple image defects, which are automatically and simultaneously acquired during the inspection process. Orbotech's unique multi-image technology enables operators to accurately differentiate between real and false defects, which are then sent to offline RMIV stations. Ultra Dimension with RMIV also reduces the number of verification stations required, thereby freeing up valuable floor space in the AOI room and allowing manufacturers to cut their overall labor and operational costs significantly.

The Ultra Dimension AOI series is now available to customers.

About Orbotech Ltd.
Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech's core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality ('reading'); pattern the desired electronic circuitry on the relevant substrate and perform three-dimensional shaping of metalized circuits on multiple surfaces ('writing'); and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing ('connecting'). Orbotech refers to this 'reading', 'writing' and 'connecting' as enabling the 'Language of Electronics'. For more information, visit www.orbotech.com  and www.spts.com

Cautionary Statement Regarding Forward-Looking Statements
Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995.  These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties.  The words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements.  These forward-looking statements are made based on management's expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech's operations and business environment, all of which are difficult to predict and many of which are beyond the Company's control.  Many factors could cause the actual results to differ materially from those projected including, without limitation, cyclicality in the industries in which the Company operates, the Company's production capacity, timing and occurrence of product acceptance (the Company defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the 'Brexit' process and administration change in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices as well as automobiles, the Company's global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the ongoing audit of tax years 2012-2014 in Israel (see below), the Company's ability to achieve strategic initiatives, including related to its acquisition strategy, the Company's debt and corporate financing activities; the final timing and outcome, and impact of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company's customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, and ongoing or increased hostilities in Israel and the surrounding areas.  In addition, in May 2017 the Company received a $58 million assessment from the Israel Tax Authority with respect to the ongoing tax audit in Israel.  The Company believes that it has provided adequately for any reasonably foreseeable outcomes related to the tax audit; however, future results may include unfavorable material adjustments to estimated tax liabilities in the period when the assessment is resolved or the audit is closed.  In addition, the Israel Tax Authority is investigating the Company's tax positions.  Given that the process is in its preliminary stages, the Company cannot assure the outcome or timing of completion of the assessment process or investigation, including the amount of tax ultimately payable, and additional penalties, criminal sanctions, fines and other amounts that may be imposed as a result of the assessment and investigation, which may be material in amount or in adverse impact on the Company's results of operations, financial position and reputation.  The outcome may also impact the Company's results of operations as a result of tax positions taken for subsequent fiscal years. Furthermore, during the second quarter of 2017, the Company elected to implement certain provisions of the Israeli Law for the Encouragement of Capital Investments related to preferred enterprises in Israel.  Although the Company is unable to predict the precise impact of this tax election, it believes the tax election will be beneficial over the long term and it does not expect that the tax election will result in a material increase in its effective tax rate for 2017. The foregoing information should be read in connection with the Company's Annual Report on Form 20-F for the year ended December 31, 2016, and subsequent SEC filings.  The Company is subject to the foregoing and other risks detailed in those reports.  The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.

ORBOTECH COMPANY CONTACTS:

Rami Rozen
Director of Investor Relations
Tel: +972-8-942-3582
Investor.relations@orbotech.com

Tally Kaplan Porat
Director of Corporate Marketing
Tel: +972-8-942-3603
Tally-Ka@orbotech.com

View original content:http://www.prnewswire.com/news-releases/orbotech-revolutionizes-the-aoi-room-with-4-in-1-aoi-solution-300541871.html

SOURCE Orbotech Ltd.



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